Intel® Stratix® 10 Device Datasheet

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ID 683181
Date 12/08/2023
Public
Document Table of Contents
Document Table of Contents x
Intel® Stratix® 10 Device Datasheet
Intel® Stratix® 10 Device Datasheet x
Electrical Characteristics Switching Characteristics Configuration Specifications I/O Timing Programmable IOE Delay Glossary Document Revision History for the Intel® Stratix® 10 Device Datasheet
Electrical Characteristics x
Operating Conditions
Operating Conditions x
Absolute Maximum Ratings Maximum Allowed Overshoot and Undershoot Voltage Recommended Operating Conditions DC Characteristics I/O Standard Specifications
Recommended Operating Conditions x
Recommended Operating Conditions Transceiver Power Supply Operating Conditions HPS Power Supply Operating Conditions
DC Characteristics x
Supply Current and Power Consumption I/O Pin Leakage Current Bus Hold Specifications OCT Calibration Accuracy Specifications OCT Without Calibration Resistance Tolerance Specifications Pin Capacitance Internal Weak Pull-Up Resistor
I/O Standard Specifications x
Single-Ended I/O Standards Specifications Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications Differential SSTL I/O Standards Specifications Differential HSTL and HSUL I/O Standards Specifications Differential I/O Standards Specifications
Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications x
Differential POD12 Standards Specifications
Switching Characteristics x
Core Performance Specifications Periphery Performance Specifications L-Tile Transceiver Performance Specifications H-Tile Transceiver Performance Specifications E-Tile Transceiver Performance Specifications P-Tile Transceiver Performance Specifications HPS Performance Specifications
Core Performance Specifications x
Clock Tree Specifications PLL Specifications DSP Block Specifications Memory Block Specifications Direct Interface Bus (DIB) Specifications Internal Temperature Sensing Diode Specifications External Temperature Sensing Diode Specifications Internal Voltage Sensor Specifications
PLL Specifications x
Fractional PLL Specifications I/O PLL Specifications
Periphery Performance Specifications x
High-Speed I/O Specifications DPA Lock Time Specifications LVDS Soft-CDR/DPA Sinusoidal Jitter Tolerance Specifications Memory Standards Supported by the Hard Memory Controller Memory Standards Supported by the Soft Memory Controller Memory Standards Supported by the HPS Hard Memory Controller DLL Range Specifications Memory Output Clock Jitter Specifications Performance Specifications of the HBM2 Interface in Intel® Stratix® 10 MX, NX, and DX 2100 Devices HBM2 Interface Performance OCT Calibration Block Specifications
L-Tile Transceiver Performance Specifications x
Transceiver Performance for Intel® Stratix® 10 L-Tile Devices Transceiver Specifications for Intel® Stratix® 10 L-Tile Devices
H-Tile Transceiver Performance Specifications x
Transceiver Performance for Intel® Stratix® 10 H-Tile Devices Transceiver Specifications for Intel® Stratix® 10 H-Tile Devices
E-Tile Transceiver Performance Specifications x
Transceiver Performance for Intel® Stratix® 10 E-Tile Devices Transceiver Reference Clock Specifications Transmitter Specifications for Intel® Stratix® 10 E-Tile Devices Receiver Specifications for Intel® Stratix® 10 E-Tile Devices
P-Tile Transceiver Performance Specifications x
Transceiver Performance for Intel® Stratix® 10 DX P-Tile Devices Transceiver Reference Clock Specifications Transmitter Specification for Intel® Stratix® 10 DX P-Tile Devices Receiver Specifications for Intel® Stratix® 10 DX P-Tile Devices
HPS Performance Specifications x
HPS Clock Performance HPS Internal Oscillator Frequency HPS PLL Specifications HPS Cold Reset HPS SPI Timing Characteristics HPS SD/MMC Timing Characteristics HPS USB UPLI Timing Characteristics HPS Ethernet Media Access Controller (EMAC) Timing Characteristics HPS I2C Timing Characteristics HPS NAND Timing Characteristics HPS Trace Timing Characteristics HPS GPIO Interface HPS JTAG Timing Characteristics HPS Programmable I/O Timing Characteristics
HPS PLL Specifications x
HPS PLL Input Requirements HPS PLL Performance
Configuration Specifications x
General Configuration Timing Specifications POR Specifications External Configuration Clock Source Requirements JTAG Configuration Timing AS Configuration Timing Avalon® -ST Configuration Timing Configuration Bit Stream Sizes
Intel® Stratix® 10 Device Datasheet

Transceiver Specifications for Intel® Stratix® 10 H-Tile Devices

Table 61.  H-Tile Reference Clock Specifications
Symbol/Description Condition Min Typ Max Unit
Supported I/O Standards Dedicated reference clock pin CML, Differential LVPECL, LVDS, and HCSL
RX reference clock pin CML, Differential LVPECL, and LVDS

Input Reference Clock Frequency (CMU PLL)

   50 — 800 MHz

Input Reference Clock Frequency (ATX PLL)

   100 — 800 MHz

Input Reference Clock Frequency (fPLL PLL)

   25 97/50 — 800 MHz
Rise time 20% to 80% — — 350 ps
Fall time 80% to 20% — — 350 ps
Duty cycle — 45 — 55 %
Spread-spectrum modulating clock frequency PCIe 30 — 33 kHz
Spread-spectrum downspread PCIe — 0 to –0.5 — %
On-chip termination resistors — — 100 — Ω
Absolute VMAX Dedicated reference clock pin — — 1.6 V
RX reference clock pin — — 1.2 V
Absolute VMIN — –0.4 — — V
Peak-to-peak differential input voltage — 200 — 1600 mV
VICM (AC coupled) VCCR_GXB =1.03 V — 0 — V
VCCR_GXB = 1.12 V — 0 — V
VICM (DC coupled) HCSL I/O standard for PCIe reference clock 250 — 550 mV
Transmitter REFCLK Phase Noise (800 MHz) 98 99 100 Hz — — –70 dBc/Hz
1 kHz — — –90 dBc/Hz
10 kHz — — –100 dBc/Hz
100 kHz — — –110 dBc/Hz
≥ 1 MHz — — –120 dBc/Hz
RREF — — 2.0 k ±1% — Ω
TSSC-MAX-PERIOD-SLEW Max SSC df/dt     0.75  
Note: When using PCI Express, you must meet the reference clock phase jitter requirements as specified in the 4.3.7 Refclk Specifications for 2.5 GT/s and 5.0 GT/s and 4.3.8 Refclk Specification for 8.0 GT/s sections of the PCI Express Base Specification Revision 3.0.
Table 62.  H-Tile Transceiver Clock Network Maximum Data Rate Specifications
Clock Network Maximum Performance 100 Channel Span Unit
ATX fPLL CMU
x1 17.4 12.5 10.3125 6 channels Gbps
x6 17.4 12.5 N/A 6 channels Gbps
x24 17.4 104 12.5 N/A

2 banks up and 1 bank down (total 24 channels)

or

2 banks down and 1 bank up (total 24 channels)

 Gbps
GXT clock lines 28.3 N/A N/A 4 GXT channels within the same transceiver bank and 2 from the bank above or 2 from the bank below. 101 Gbps
Table 63.  H-Tile Receiver Specifications
Symbol/Description Condition All Transceiver Speed Grades Unit
Min Typ Max
Supported I/O Standards — High Speed Differential I/O, CML, Differential LVPECL, and LVDS
Absolute VMAX for a receiver pin 102 — — — 1.2 V
Absolute VMIN for a receiver pin 103 — -0.4 — — V
Maximum peak-to-peak differential input voltage VID (diff p-p) before device configuration — — — 2.0 V
Maximum peak-to-peak differential input voltage VID (diff p-p) after device configuration VCCR_GXB = 1.03 V — — 2.0 V
VCCR_GXB = 1.12 V 104, 105 — — 1.8 V
Differential on-chip termination resistors 85-Ω setting — 85 ± 20% — Ω
100-Ω setting — 100 ± 20% — Ω
VICM (AC coupled) VCCR_GXB = 1.03 V 105 — 700 — mV
VCCR_GXB = 1.12 V 105 — 750 — mV
tLTR 106 — — — 1 ms
tLTD 107 — 4 — — µs
tLTD_manual 108 — 4 — — µs
tLTR_LTD_manual 109 — 15 — — µs
Run Length — — — 200 UI
CDR ppm tolerance PCIe-only -300 — 300 ppm
All other protocols -1000 — 1000 ppm
Table 64.  H-Tile Transmitter Specifications
Symbol/Description Condition Transceiver Speed Grade 3 Unit
Min Typ Max
Supported I/O Standards — High Speed Differential I/O 110 —
Differential on-chip termination resistors 85-Ω setting — 85 ± 20% — Ω
100-Ω setting — 100 ± 20% — Ω
VOCM (AC coupled) VCCT_GXB = 1.03 V 111 — 515 — mV
VOCM (AC coupled) VCCT_GXB = 1.12 V 111 — 560 — mV
VOCM (DC coupled) 112 VCCT_GXB = 1.03 V 111 — 515 — mV
VOCM (DC coupled) 112 VCCT_GXB = 1.12 V 111 — 560 — mV
Rise time 113 20% to 80% 20 — 130 ps
Fall time 113 80% to 20% 20 — 130 ps
Intra-differential pair skew TX VCM = 0.5 V and slew rate of 15 ps — — 15 114 ps
Table 65.  H-Tile Typical Transmitter VOD Settings
Symbol VOD Setting 115 VOD/VCCT_GXB Ratio
VOD differential value = VOD/VCCT_GXB ratio x VCCT_GXB 31 1.00
30 0.97
29 0.93
28 0.90
27 0.87
26 0.83
25 0.80
24 0.77
23 0.73
22 0.70
21 0.67
20 0.63
19 0.60
18 0.57
17 0.53
16 0.50
15 0.47
14 0.43
13 0.40
12 0.37
Table 66.  H-Tile Transmitter Channel-to-channel Skew Specifications
Mode Channel Span Maximum Skew Unit
x6 Clock Up to 6 channels in one bank 61 ps
x24 Clock Up to 24 channels in one bank 500 116 ps
Table 67.  Transceiver Clocks Specifications for Intel® Stratix® 10 H-Tile Devices
Clock Value Unit
reconfig_clk ≤ 150 MHz
fixed_clk for the RX detect circuit 250 ± 20% MHz

For OSC_CLK_1 specifications, refer to the External Configuration Clock Source Requirements section.

Related Information
97 The 25 MHz is only available when HDMI is selected for fPLL protocol mode.
98 To calculate the REFCLK phase noise requirement at frequencies other than 800 MHz, use the following formula: REFCLK phase noise at f (MHz) = REFCLK phase noise at 800 MHz + 20*log(f/800).
99 A phase noise (PN) mask overrides the REFCLK noise.
100 The maximum data rate depends on speed grade.
101 If the upper ATX PLL in a bank is used as the main GXT PLL, then the channel span includes two GXT channels from the bank above. If the lower ATX PLL in a bank is used as the main GXT PLL, then the channel span includes two GXT channels from the bank below.
102 The device cannot tolerate prolonged operation at this absolute maximum.
103 A passive pull up resistance prevents a 0-V common mode voltage on AC coupled receiver pins before the FPGA is configured.
104 Bonded channels operating at data rates above 16 Gbps require 1.12 V ± 20 mV at the pin. For channels that are placed in the same H-Tile as the channels that required 1.12 V ± 20 mV, VCCR_GXB = 1.12 V ± 20 mV.
105 For GXT channels, VCCR_GXB must be 1.12 V. For GX channels, VCCR_GXB must be 1.03 V. VCCR_GXB must be 1.12 V for the transceiver on the same H-Tile when using GX and GXT channels together.
106 tLTR is the time required for the receive CDR to lock to the input reference clock frequency after coming out of reset or after CDR calibration is completed.
107 tLTD is time required for the receiver CDR to start recovering valid data after the rx_is_lockedtodata signal goes high.
108 tLTD_manual is the time required for the receiver CDR to start recovering valid data after the rx_is_lockedtodata signal goes high when the CDR is functioning in the manual mode.
109 tLTR_LTD_manual is the time the receiver CDR must be kept in lock to reference (LTR) mode after the rx_is_lockedtoref signal goes high when the CDR is functioning in the manual mode.
110 High Speed Differential I/O is the dedicated I/O standard for the transmitter in Intel® Stratix® 10 transceivers.
111 For GXT channels, VCCT_GXB must be 1.12 V. For GX channels, VCCT_GXB must be 1.03 V. VCCT_GXB must be 1.12 V when using GX and GXT channels together within the same H-Tile.
112 DC coupling specifications are pending silicon characterization.
113 The Intel® Quartus® Prime software automatically selects the appropriate slew rate depending on the configured data rate or functional mode.
114 This specification pertains to Hyper Memory Cube.
115 Intel recommends a VOD ranging from 31 to 17.
116 500 ps is not supported for all configurations and depends upon the Master CGB placement.
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