Intel® Stratix® 10 Device Datasheet

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ID 683181
Date 12/08/2023
Public
Document Table of Contents
Document Table of Contents x
Intel® Stratix® 10 Device Datasheet
Intel® Stratix® 10 Device Datasheet x
Electrical Characteristics Switching Characteristics Configuration Specifications I/O Timing Programmable IOE Delay Glossary Document Revision History for the Intel® Stratix® 10 Device Datasheet
Electrical Characteristics x
Operating Conditions
Operating Conditions x
Absolute Maximum Ratings Maximum Allowed Overshoot and Undershoot Voltage Recommended Operating Conditions DC Characteristics I/O Standard Specifications
Recommended Operating Conditions x
Recommended Operating Conditions Transceiver Power Supply Operating Conditions HPS Power Supply Operating Conditions
DC Characteristics x
Supply Current and Power Consumption I/O Pin Leakage Current Bus Hold Specifications OCT Calibration Accuracy Specifications OCT Without Calibration Resistance Tolerance Specifications Pin Capacitance Internal Weak Pull-Up Resistor
I/O Standard Specifications x
Single-Ended I/O Standards Specifications Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications Differential SSTL I/O Standards Specifications Differential HSTL and HSUL I/O Standards Specifications Differential I/O Standards Specifications
Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications x
Differential POD12 Standards Specifications
Switching Characteristics x
Core Performance Specifications Periphery Performance Specifications L-Tile Transceiver Performance Specifications H-Tile Transceiver Performance Specifications E-Tile Transceiver Performance Specifications P-Tile Transceiver Performance Specifications HPS Performance Specifications
Core Performance Specifications x
Clock Tree Specifications PLL Specifications DSP Block Specifications Memory Block Specifications Direct Interface Bus (DIB) Specifications Internal Temperature Sensing Diode Specifications External Temperature Sensing Diode Specifications Internal Voltage Sensor Specifications
PLL Specifications x
Fractional PLL Specifications I/O PLL Specifications
Periphery Performance Specifications x
High-Speed I/O Specifications DPA Lock Time Specifications LVDS Soft-CDR/DPA Sinusoidal Jitter Tolerance Specifications Memory Standards Supported by the Hard Memory Controller Memory Standards Supported by the Soft Memory Controller Memory Standards Supported by the HPS Hard Memory Controller DLL Range Specifications Memory Output Clock Jitter Specifications Performance Specifications of the HBM2 Interface in Intel® Stratix® 10 MX, NX, and DX 2100 Devices HBM2 Interface Performance OCT Calibration Block Specifications
L-Tile Transceiver Performance Specifications x
Transceiver Performance for Intel® Stratix® 10 L-Tile Devices Transceiver Specifications for Intel® Stratix® 10 L-Tile Devices
H-Tile Transceiver Performance Specifications x
Transceiver Performance for Intel® Stratix® 10 H-Tile Devices Transceiver Specifications for Intel® Stratix® 10 H-Tile Devices
E-Tile Transceiver Performance Specifications x
Transceiver Performance for Intel® Stratix® 10 E-Tile Devices Transceiver Reference Clock Specifications Transmitter Specifications for Intel® Stratix® 10 E-Tile Devices Receiver Specifications for Intel® Stratix® 10 E-Tile Devices
P-Tile Transceiver Performance Specifications x
Transceiver Performance for Intel® Stratix® 10 DX P-Tile Devices Transceiver Reference Clock Specifications Transmitter Specification for Intel® Stratix® 10 DX P-Tile Devices Receiver Specifications for Intel® Stratix® 10 DX P-Tile Devices
HPS Performance Specifications x
HPS Clock Performance HPS Internal Oscillator Frequency HPS PLL Specifications HPS Cold Reset HPS SPI Timing Characteristics HPS SD/MMC Timing Characteristics HPS USB UPLI Timing Characteristics HPS Ethernet Media Access Controller (EMAC) Timing Characteristics HPS I2C Timing Characteristics HPS NAND Timing Characteristics HPS Trace Timing Characteristics HPS GPIO Interface HPS JTAG Timing Characteristics HPS Programmable I/O Timing Characteristics
HPS PLL Specifications x
HPS PLL Input Requirements HPS PLL Performance
Configuration Specifications x
General Configuration Timing Specifications POR Specifications External Configuration Clock Source Requirements JTAG Configuration Timing AS Configuration Timing Avalon® -ST Configuration Timing Configuration Bit Stream Sizes
Intel® Stratix® 10 Device Datasheet

Receiver Specifications for Intel® Stratix® 10 E-Tile Devices

Table 72.  E-Tile Receiver Specifications
Symbol/Description Condition Minimum Typical Maximum Unit
Supported I/O Standards — LVPECL —
Absolute VMAX for a receiver pin121 NRZ — VCCH_GXE + 0.3 — V
PAM4 — VCCH_GXE — V
Maximum peak-to-peak differential input voltage VID (diff p-p) before/after device configuration121 — 1.2 V
VCM (AC coupled)120 121 NRZ GND — VCCH_GXE V
PAM4 GND + 0.3 — VCCH_GXE – 0.3 V
Receiver run length122 — — — 100123 symbols
DC input impedance — 40 — 60 Ω
DC differential input impedance — 80 100 120 Ω
Powered down DC input impedance Receiver pin impedance when the receiver termination is powered down 100k — — Ω
Differential termination From DC to 100 MHz 80 100 120 Ω
PPM tolerance Allowed frequency mismatch between REFCLK and RX data — — 750 ppm
120 These values use internal AC-coupling. External AC-coupling capacitors are required when the RX input common mode voltage is beyond the range mentioned in this table (for PAM4 or NRZ). When using external AC-coupling capacitors, the RX termination is set to VCCH_GXE. When using internal AC-coupling capacitors, set the RX termination floating. The external AC-coupling capacitor has a typical value of at least 100 nF.
121 To support Hot Swap with E-tile, ensure the following:
  • RX inputs have external AC coupling capacitors of at least 100 nF.
  • The absolute voltage applied to the RX+ and RX- pins should not exceed ±300 mV (for a total of 600 mV p-p) (single ended).
  • The total differential voltage (combination of RX+/RX-) should not exceed 1,200 mV.
  • The transceiver termination selection must be external AC coupling (during mission mode).
122 No additional transition density requirements apply.
123 The incoming data must be statistically DC-balanced.
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