Article ID: 000080532 Content Type: Troubleshooting Last Reviewed: 09/11/2012

When selecting a heat sink for an Arria II GX lidless package, do I need to be concerned about any exposed substrate de-coupling capacitors?

Environment

BUILT IN - ARTICLE INTRO SECOND COMPONENT
Description

There are no exposed de-coupling capacitors on the substrate on Arria® II GX devices in the lidless package.

You should follow the guidelines in AN-358: Thermal Management for FPGAs (PDF) for designing a heat sink for lidless packages.

Related Products

This article applies to 1 products

Arria® II GX FPGA