Build with Leading-Edge Manufacturing Process Technologies
Capitalize on Intel’s legacy of delivering consistent innovation that continues today with Intel Foundry.
Beyond Five Nodes in Four Years (5N4Y)
With execution to our ambitious five nodes in four years (5N4Y) goal on track, Intel revealed at Intel Foundry Direct Connect '24 an extended process technology roadmap adding:
- Intel 14A to the company’s leading-edge node plan,
- Several specialized node evolutions for Intel 3, Intel 18A, and Intel 14A, including Intel 3-PT with through-silicon vias for 3D advanced packaging designs, and
- Mature process nodes, including new 12-nanometer nodes expected through joint development with UMC.
Customers ready to design can start their engagement with Intel Foundry today.
Intel 18A: Biggest Innovation Since FinFET
Introduces RibbonFET and PowerVia:
- Our biggest innovation since Intel introduced FinFETs to HVM in 2011.
- RibbonFET, Intel Foundry’s implementation of a Gate-all-around (GAA) transistor, improves density and performance versus FinFET.
- Optimized ribbon stack delivers superior performance per watt and minimum supply voltage (Vmin).
- PowerVia is Intel’s unique industry-first implementation of backside power delivery architecture that improves standard cell utilization by up to 10% and performance by greater than 5%.1
- Well-suited for High Performance Computing (HPC) and mobile applications.
Intel 16: The Ideal Gateway to FinFET
Advantages of FinFET with flexibility of planar:
- Performance of a 16nm class node with fewer masks and simpler back-end design rules.
Intel 3: Intel’s Ultimate FinFET Node
High-performance per watt with extensive Extreme Ultraviolet (EUV) use:
- Evolution of Intel 4 with 0.9x logic scaling and 17% performance per watt improvement.2
- Adds denser library, improved drive current and interconnect while benefiting from Intel 4 learnings for faster yield ramp.
- Well-suited for general compute applications.
Now Previewing to Select Customers
Intel 14A: 2nd Gen PowerVia Combined with RibbonFET
Industry First High Numerical Aperture (High NA) EUV
- High NA is foundational to cost-effective scaling.
See Our Other World-Class Foundry Offerings
To help you build the next generation of silicon, we’re driving global leadership with numerous investments in manufacturing sites around the world. Our unique offerings are enabled by advanced process technologies complemented by our robust partner ecosystem.
Global Manufacturing
Benefit from a robust, geo-diverse, and expanding supply for wafers and assembly & test.
Learn more
Design Ecosystem
Reimagine your designs with a unique combination of Intel Foundry technology, IP, EDA and services through the Intel Foundry Accelerator ecosystem alliance program.
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Intel Foundry Portal
Notices and Disclaimers3
Product and Performance Information
Based on Intel internal analysis.
This webpage contains forward-looking statements about Intel’s future plans or expectations, including with respect to future technology and products and the expected benefits and availability of such technology and products. These statements are based on current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in such statements. For more information on the factors that could cause actual results to differ materially, see our most recent earnings release and SEC filings at www.intc.com.