Demonstration of concept to bring the endcap to life using Intel embedded technology.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Processor insertion guide for LGA115X socket independent loading mechanism, minimizing contact damage.