Demonstration of concept to bring the endcap to life using Intel embedded technology.
With SAP HANA* and Intel you get purpose-built integration that accelerates and simplifies your business.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Intel’s ESD prevention methods prevent costly damage to electronic devices.