Delivering World-Class Quality Leadership
Intel Quality and Reliability
Quality and Reliability at a glance
- Intel's manufacturing quality processes
- Customer manufacturing enabling program
- Quality document management system
- Functional analysis
- Customer information service portal
- ISO registrations
State-of-the-art manufacturing quality processes support sustaining and advancement of our semiconductor manufacturing technologies.Learn more >
Intel® Customer Manufacturing Enabling brings Intel® technology and manufacturing expertise to customers to increase manufacturing success for customers, to assure growth in new areas, and to provide services for process optimization.Learn more >
Search, view, and download product change notice (PCN) and material declaration data sheet (MDDS) information.Learn more >
Intel's analysis labs unite experts with state of the art capabilities to support product qualification, manufacturing, and customer needs.Learn more >
CISP is a portal to enable customer access to Quality and Reliability content. This site provides customers with access to frequently-asked subject areas such as ecology, product information, reliability, manufacturing enabling documents, and product change notices through search, view, and download.Learn more >
All of Intel's mature manufacturing Wafer Fabrication, Assembly/Test sites, and Logistics centers are registered to ISO 9001:2008 by a third-party registrar.Learn more >
Your resource guide to assist in facilitating access to information such as International Standards (ISO), and other resourceful documents and downloads.View resources >
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Intel, Your Trusted Reliability Advisor
See how Intel uses knowledge-based qualification to qualify products in unique usage environments.
CQN: The Secret of Intel’s Quality Promise
See how Intel’s Corporate Quality Network (CQN) ensures only the highest-quality products go to market.
Vishay Micro-Measurements Strain Gage
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Corner Glue: Application Techniques and Materials
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Intel® LGA115X Socket: Board Factory
Guide to LGA115X socket independent loading mechanism installation, minimizing contact damage.
Package-on-Package Devices: Ball Grid Array Rework
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Antenna and Oscilloscope: Electrostatic Discharge Detection
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Kyowa Strain Gage
Shows how to attach Kyowa strain gage to Intel® Ball Grid Array packages; measures board flexure.
IoT Innovation: Asset Tracking and Monitoring
Chen Han Lim demos a solution that collects machine data in a mobile app for manufacturing efficiency.
Real-World IoT Deployment in an Intel Factory
How real-time factory big data enables smarter decision making and performance with new opportunity.
Automaker GM Speeds IT for Success
GM leaders discuss rapid data sharing to bring vehicles to market faster and increase sales. (273:53)
Training Video: Intelligent Factory Applications
Video: The benefits of using the Intel® Quark™ SoC X1000 in automated industrial systems. (Oct. 2014)