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Intel® Communications Chipset 89xx Series AMC Reference Design Kit


Intel® Communications Chipset 89xx Series: Design Guide

Design Guide: Thermal and mechanical design specifications for the Intel® Communications Chipset 89xx Series. (v.001, Oct. 2012)

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Intel® Atom™ Processor 200 Series: Thermal/Mechanical Design Guide

Thermal and Mechanical Design Guide: Intel® Atom™ processor 200 series.

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Intel® Communications Chipset 8920: Power Guide Addendum

Addendum: Provides power consumption information on the Intel® Communications Chipset 8920 while it is running on industry standard applications.

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Application Power Guideline for Intel® Embedded Processors

White Paper: Application Power Guidelines based on realistic power consumption estimates for Intel® Embedded processors. (v.001, Dec. 2010)

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Intel® Atom™ LEAP* Platform: Energy-Efficient Embedded Computing

Reiher and Kaiser, UCLA, discuss Intel® Atom™ LEAP* architecture and embedded systems instructions for energy efficiency.

Advanced Board Bring Up: Power Up Sequencing Guide

White Paper: Explains power-up sequencing and debug for embedded platforms from power on to the first BIOS code fetch. (v.001, Apr. 2011)

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PCB Stack-up Overview for Intel® Architecture Platforms

White Paper: PCB stack-up designs for Intel® Architecture platforms meet high-speed needs, addressing challenges with speed and costs. (Dec. 2008)

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Multi-Core Processor Performance Optimization

Sarma Vrudhula of Arizona State University presents research on multi-core processor performance optimization under thermal constraints.

ACPI Provides Efficiencies for Firmware Development

Article: Operating system-directed power management using ACPI provides cost-effective firmware development and fast time to market. (v.1, July 2009)

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