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Intel® EP80579 Integrated Processor Product Line: Thermal GuideThe power dissipation required for electronic components has risen along with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over a product's life cycle, the heat generated by the component must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.The goals of this document are to:• Describe the thermal and mechanical specifications for Intel® EP80579 Integrated Processor product line• Describe reference solutions that meet the Intel® EP80579 Integrated Processor product line’s thermal and mechanical specificationsRead the full Intel® EP80579 Integrated Processor Product Line Thermal Design Guide.
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Intel® Xeon® processors provide power savings, scalability performance, integration, and more.
Discusses Intel® Atom™ LEAP* architecture and embedded systems instructions for energy efficiency.
Presents research on multi-core processor performance optimization under thermal constraints.
Overviews the Intel® Atom™ processor E6xx series’ features and compatibility.
Features and benefits include a variety of supported operating systems, software, and other tools.
First Intel® Atom™ processor-based system-on-chip offers embedded system integration and flexibility.