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Processor insertion guide for LGA115X socket independent loading mechanism, minimizing contact damage.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Ensure consistent quality and minimize accidents with handling recommendations and practices.
Shows how to attach Kyowa strain gage to Intel® Ball Grid Array packages; measures board flexure.
Guide to LGA115X socket independent loading mechanism installation, minimizing contact damage.
Mandarin: Guide to LGA115X socket independent loading mechanism installation.
GM leaders discuss rapid data sharing to bring vehicles to market faster and increase sales.