Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.